Next Gen iPhone Components Shows 3.2mp Camera, Infineon Chip
Digitimes (via MacRumors) has put together a list of which supplier is providing what part -- they think! -- for Apple's next generation iPhone, ever-increasingly assumed to be announced at WWDC in June. No huge surprises, with iPhone 2G and 3G stalwart Infineon continuing to make the baseband (guess a home-spun PA Semi chip isn't entirely replacing them yet), and Samsung to provide the NAND Flash storage.
Those hyped about the rumors of a possible 5.0 megapixel camera on board, however, take note of the 3.2 spec noted above. No replacing those Canon 5D Mark II's yet!