Next Gen iPhone Components Shows 3.2mp Camera, Infineon Chip

By Rene Ritchie
last updated

Digitimes (via MacRumors) has put together a list of which supplier is providing what part -- they think! -- for Apple's next generation iPhone, ever-increasingly assumed to be announced at WWDC in June. No huge surprises, with iPhone 2G and 3G stalwart Infineon continuing to make the baseband (guess a home-spun PA Semi chip isn't entirely replacing them yet), and Samsung to provide the NAND Flash storage.

Those hyped about the rumors of a possible 5.0 megapixel camera on board, however, take note of the 3.2 spec noted above. No replacing those Canon 5D Mark II's yet!

Rene Ritchie
Rene Ritchie
Contributor

Rene Ritchie is one of the most respected Apple analysts in the business, reaching a combined audience of over 40 million readers a month. His YouTube channel, Vector, has over 90 thousand subscribers and 14 million views and his podcasts, including Debug, have been downloaded over 20 million times. He also regularly co-hosts MacBreak Weekly for the TWiT network and co-hosted CES Live! and Talk Mobile. Based in Montreal, Rene is a former director of product marketing, web developer, and graphic designer. He's authored several books and appeared on numerous television and radio segments to discuss Apple and the technology industry. When not working, he likes to cook, grapple, and spend time with his friends and family.